Lead-Free Solder Process Development

This practical guide provides a fully up-to-date, practical approach to implementing lead-free soldering, presented by leading industry experts. It addresses a list of key topics not covered sufficiently in other texts, such as soldering fluxes, SMT, wave, rework, alloys, component finishes, EDXRF, and certain areas on reliability.

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks

This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. 

• Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution
• Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB)
• Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD)
• Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers

Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

Contributor: Gregory Henshall (Edited by), Jasbir Bath (Edited by), Carol A. Handwerker (Edited by)

UK Delivery:

• Free delivery on all orders of £10 or more.
• £1.49 delivery fee on orders below £10.
• UK orders are shipped via Royal Mail 2nd Class.

International Delivery:

• Flat rate delivery charges vary by country.

Dispatch and Delivery Times:

• All orders are shipped from our warehouse in Northampton, UK within 48 hours of receipt during working hours.
• UK mainland orders typically arrive within 3-5 working days via Royal Mail 2nd Class.
• International estimated delivery times:
• Europe & Channel Islands: 7 to 10 working days
• USA: 7 to 15 working days
• Rest of the World: 9 to 21 working days

View our full delivery infomation here.