Adhesion in Microelectronics

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source.

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include;

• Various theories or mechanisms of adhesion
• Surface (physical or chemical) characterization of materials as it pertains to adhesion
• Surface cleaning as it pertains to adhesion
• Ways to improve adhesion
• Unraveling of interfacial interactions using an array of pertinent techniques
• Characterization of interfaces / interphases
• Polymer-polymer adhesion
• Metal-polymer adhesion  (metallized polymers)
• Polymer adhesion to various substrates
• Adhesion of thin films
• Adhesion of underfills
• Adhesion of molding compounds
• Adhesion of different dielectric materials
• Delamination and reliability issues in packaged devices
• Interface mechanics and crack propagation
• Adhesion measurement of thin films and coatings

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• UK mainland orders typically arrive within 3-5 working days via Royal Mail 2nd Class.
• International estimated delivery times:
• Europe & Channel Islands: 7 to 10 working days
• USA: 7 to 15 working days
• Rest of the World: 9 to 21 working days

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