{"product_id":"9783527352425-thermal-management-materials-c","title":"Thermal Management Materials for Electronic Packaging","description":"\u003cmeta content=\"text\/html; charset=utf-8\" http-equiv=\"Content-Type\"\u003e\u003cp\u003e\u003cspan\u003ePreparation, Characterization, and Devices\u003cbr\u003e\u003cb\u003eThermal Management Materials for Electronic Packaging\u003c\/b\u003e \u003cp\u003e\u003cb\u003ePractical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging\u003c\/b\u003e \u003c\/p\u003e\n\u003cp\u003e\u003ci\u003eThermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices \u003c\/i\u003eprovides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. \u003c\/p\u003e\n\u003cp\u003eThe text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area.  \u003c\/p\u003e\n\u003cp\u003eSample topics covered in \u003ci\u003eThermal Management Materials for Electronic Packaging \u003c\/i\u003einclude: \u003c\/p\u003e\n\u003cul\u003e\n\u003cli\u003e Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids\u003c\/li\u003e\n\u003cli\u003e Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials\u003c\/li\u003e\n\u003cli\u003e Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure\u003c\/li\u003e\n\u003cli\u003e Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003e\u003ci\u003eThermal Management Materials for Electronic Packaging \u003c\/i\u003eserves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.\u003c\/p\u003e\n\u003cbr\u003e\u003cbr\u003e\u003c\/span\u003e\u003c\/p\u003e","brand":"Rarewaves","offers":[{"title":"Default Title","offer_id":41271013310561,"sku":"9783527352425","price":166.81,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0092\/7504\/8033\/files\/orig_38850513_096c9107-0f8f-43fd-9eb8-84ba8005b45a.jpg?v=1764391685","url":"https:\/\/www.rarewaves.com\/products\/9783527352425-thermal-management-materials-c","provider":"Rarewaves.com","version":"1.0","type":"link"}